TAIPEI — Taiwan Semiconductor Manufacturing Co. is close to finalizing the specifications for a radically new approach to chip packaging to meet demand for more powerful AI chips, with plans to start small volumes of production around 2027, Nikkei Asia has learned.
While chips are generally built on 300-millimeter round wafers, TSMC’s new technology, referred to in the industry as “panel-level” advanced chip packaging, will use a square substrate that can accommodate more semiconductors and thus boost computing performance.
